Tungsten Alloy Rod in Semiconductor Equipment

Tungsten alloy rod is high specific gravity tungsten alloy rod featuring high density, high strength, good dimensional stability, and precision machining capability. CTIA’s tungsten alloy rod is suitable for semiconductor equipment requiring compact structures, high-precision motion control, and long-term reliable operation. It is widely used in ion implantation equipment components, wafer transfer mechanism counterweights, local shielding parts, and precision mechanical structures.

1. Characteristics of CTIA’s Tungsten Alloy Rod in Semiconductor Equipment
Semiconductor manufacturing equipment requires materials with excellent space efficiency, mechanical stability, and precision machining capability. CTIA’s tungsten alloy rod meets the requirements of precision semiconductor components through the following characteristics:
(1) Density
Density of 16.5–18.8 g/cm³ enables high mass within limited spaces, making it suitable for wafer transfer mechanism counterweights and compact local shielding structures.
(2) Dimensional Stability
High mechanical strength and low coefficient of thermal expansion maintain dimensional accuracy under long-term operation and temperature variations, meeting precision positioning and motion control requirements.
(3) Machinability
Improved toughness and processing performance compared with pure tungsten enable machining of complex precision components through turning, milling, grinding, wire cutting, and other methods.
(4) Radiation Shielding Performance
High atomic number and high density of tungsten provide effective radiation attenuation capability for ion beam control and local shielding, reducing internal radiation interference.

2. Applications of CTIA’s Tungsten Alloy Rod in Semiconductor Equipment
(1) Ion Implantation Equipment Components
Used to manufacture beam shields, beam interceptors, and support components, improving ion beam control stability and reducing stray particle effects.
(2) Wafer Transfer Mechanism Counterweights
Used for robotic arm counterweight rods and balance components to provide high inertia, improving motion stability and positioning accuracy.
(3) Etching and Thin Film Deposition Equipment Components
Applied in vacuum chamber supports, connectors, and wafer transfer mechanism counterweight components to enhance long-term equipment reliability.
(4) Semiconductor Packaging and Testing Equipment Components
Used for vibration-damping counterweights, precision supports, and positioning components to improve stability during high-speed operation.

3. Specifications of CTIA’s Tungsten Alloy Rod in Semiconductor Equipment
(1) Grades: W-Ni-Fe and W-Ni-Cu series, various tungsten content grades available
(2) Tungsten Content: 90%–97%
(3) Density: 16.5–18.8 g/cm³
(4) Dimensions: Diameter 3–50 mm, length 100–1000 mm, customizable
(5) Surface Conditions: Ground, polished, etc.

CTIA GROUP specializes in tungsten alloy manufacturing with nearly 30 years of experience and possesses comprehensive capabilities in powder metallurgy and precision machining. Through strict control of material composition, microstructure, and dimensional accuracy, CTIA manufactures W-Ni-Fe and W-Ni-Cu series tungsten alloy rods in various grades, including 90WNiFe, 90WNiCu, 92.5WNiFe, 92.5WNiCu, 92.5WNiFeMo, 93WNiFeMo, 95WNiFe, 95WNiCu, and 97WNiFe, with customized dimensions and precision machining solutions available to meet semiconductor equipment structures, operating environments, and application requirements.

For any inquiry, please contact tungsten alloy manufacturer: CTIA GROUP

Email: sales@chinatungsten.com

Tel: 0086 592 5129696 / 0086 592 5129595

Website: tungsten-alloy.com

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